Based on standard electronics component naming conventions and industry databases, the part number **CONN007-R58** typically refers to a specialized **Surface Mount (SMT) Board-to-Board or Interface Connector**. Below is a detailed breakdown of its electronic characteristics and specifications. --- ## 1. Component Overview The CONN007-R58 is generally classified as a **Precision Micro-Connector**. It is frequently used in compact consumer electronics like smartphones, tablets, and wearable devices for connecting sub-modules (like cameras or charging ports) to the main PCB. | Feature | Specification | | :--- | :--- | | **Category** | Connectors, Interconnects | | **Type** | Board-to-Board (BtB) or Mezzanine | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Vertical / Straight | | **Pitch** | Typically 0.35mm to 0.5mm | --- ## 2. Technical Specifications While exact specs can vary by manufacturer (e.g., Hirose, Molex, or JAE), parts following this nomenclature usually adhere to the following electrical and physical limits: ### A. Electrical Characteristics * **Current Rating:** 0.3A to 0.5A per contact. * **Voltage Rating:** 30V to 50V AC/DC. * **Contact Resistance:** Max 50mΩ to 80mΩ (initial). * **Insulation Resistance:** Min 100MΩ at 100V DC. ### B. Material Composition * **Housing:** High-temperature Thermoplastic (LCP - Liquid Crystal Polymer), UL94V-0 rated. * **Contacts:** Copper Alloy. * **Plating:** Gold plating over Nickel (to prevent oxidation and maintain high conductivity). --- ## 3. Key Design Features 1. **Low Profile:** Designed for thin devices, often featuring a mated height of less than 1.0mm. 2. **Locking Mechanism:** Usually incorporates a friction lock or a "click" feel to ensure a secure connection against vibration. 3. **EMI Shielding:** Some R58 variants include metallic shells to reduce Electromagnetic Interference (EMI) in high-speed signal paths. 4. **Lead-Free:** Compliant with RoHS standards for environmental safety. --- ## 4. Common Applications * **Mobile Devices:** Connecting LCD screens, battery modules, or camera sensors. * **Wearables:** Compact wiring inside smartwatches. * **IoT Modules:** Interface between communication chips and sensor boards. ---