The part number **ATS-16E-144-C1-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series, specifically designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~2.93 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Total Height** | 25.00 mm | | **Dimensions (LxW)** | 30.00 mm x 30.00 mm | --- ### 2. Breakdown of the Part Number The alphanumeric string follows the ATS standard nomenclature: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **16:** The specific series identifier. * **E:** Material/Finish code (Blue Anodized Aluminum). * **144:** Specific dimension/geometry code for this series. * **C1:** Refers to the Thermal Interface Material (TIM). "C1" typically denotes **Phase Change Material** or high-performance thermal pad pre-applied to the base. * **R0:** RoHS compliance and revision status. --- ### 3. Key Electronic/Physical Components #### A. The Heat Sink Body Constructed from aluminum for its high thermal conductivity-to-weight ratio. The blue anodized finish provides surface protection and improves radiant heat transfer. #### B. The Push Pin Mechanism Unlike adhesive-based heat sinks, this uses a spring-loaded push pin system. * **Purpose:** Ensures consistent pressure between the heat sink and the chip. * **Safety:** Prevents the heat sink from shifting during vibration or mechanical shock. #### C. Thermal Interface Material (TIM) The bottom of the unit comes with a pre-applied thermal pad. This fills the microscopic air gaps between the chip surface and the heat sink base, significantly reducing thermal resistance. --- ### 4. Application Use-Case This part is typically used in: 1. **Network Switches:** Cooling ASICs. 2. **Embedded Systems:** Small form factor motherboards. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators.