The **ATS-1098-C1-R0** is a specialized thermal management component, specifically a high-performance heat sink designed by **Advanced Thermal Solutions (ATS)**. It is part of their "SuperGrip" series, which focuses on high-density component cooling with secure attachment mechanisms. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Fin Array (typically cross-cut or straight fin) | | **Attachment Method** | SuperGrip™ (Plastic Clip and Stainless Steel Spring) | | **Material** | Aluminum (Anodized) | | **Thermal Resistance** | Dependent on Airflow (typ. 3.0°C/W to 1.5°C/W) | | **Typical Dimensions** | 40mm x 40mm x 23mm (approximate for the 1098 series) | --- ### Key Electronic & Mechanical Features #### 1. SuperGrip™ Attachment Mechanism The "C1" in the part number often refers to the specific clip and frame assembly. This system provides: * **High Retention Force:** Ensures consistent contact pressure between the heat sink and the electronic component (FPGA, GPU, or CPU). * **No Hole Requirement:** Unlike screw-down heat sinks, this clips directly onto the component's PCB footprint or perimeter, saving board space. * **Vibration Resistance:** Designed to meet Telecordia and military-grade shock/vibration standards. #### 2. Material and Coating * **Aluminum Construction:** Provides a balance between lightweight design and high thermal conductivity. * **Blue Anodized Finish:** Most ATS-1098 models feature a blue anodized coating, which increases surface emissivity and provides corrosion resistance. #### 3. Thermal Interface Material (TIM) The "R0" suffix typically denotes the revision or the factory-applied interface material. Usually, these come with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad on the base to minimize air gaps between the heat sink and the chip. --- ### Common Applications This part is generally found in high-performance computing environments where board space is at a premium: * **Network Switches & Routers:** Cooling high-speed ASICs. * **Industrial Embedded Systems:** Cooling processors in harsh environments. * **Telecommunications:** Cooling RF components and optical modules. ---