The **ATS-05A-07-C3-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *push-pin* attachment line, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Category** | Heat Sinks | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.70mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 17.09 °C/W (at 100 LFM) | | **Fin Type** | Straight | --- ### 2. Physical Design and Components * **Heat Sink Body:** The body is made of extruded aluminum. The blue anodized finish is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. * **Push-Pin Mechanism:** This part uses a specialized "push-pin" system. This consists of a plastic pin and a spring that applies precise pressure to the component, ensuring a solid thermal connection without the need for tools. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or pre-applied phase-change material on the base to fill microscopic air gaps between the chip and the heat sink. --- ### 3. Part Number Breakdown Understanding the nomenclature helps identify the specific variant: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **05** | Series designation | | **A** | Material (Aluminum) | | **07** | Height code (approx. 12.7mm) | | **C3** | Thermal Interface Material (TIM) type/Base configuration | | **R0** | Revision code / Packaging | --- ### 4. Application Use Cases The ATS-05A-07-C3-R0 is commonly used in: * **Networking Hardware:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Video Processing:** Cooling FPGAs or ASICs that generate moderate heat.