The **AISC-0805-R056** is a surface-mount (SMD) wire-wound ceramic chip inductor. It is commonly used in high-frequency applications where high precision and high quality factors (Q) are required. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the component's physical and electrical characteristics: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **AISC** | Series | Abracon Inductor Surface Ceramic | | **0805** | Case Size | Physical dimensions (approx. 2.0 x 1.25 mm) | | **R056** | Inductance Value | **0.056 µH** (or 56 nH) | --- ### 2. Electrical Specifications Based on standard manufacturer datasheets (such as Abracon), here are the typical technical parameters for this specific value: | Parameter | Value / Range | | :--- | :--- | | **Inductance** | 56 nH (0.056 µH) | | **Tolerance** | Typically ±5% (J) or ±10% (K) | | **Quality Factor (Q) Min** | 60 (at 350 MHz) | | **Self-Resonant Frequency (SRF)** | ~1900 MHz (Minimum) | | **DC Resistance (DCR) Max** | 0.18 Ω | | **Rated Current (Max)** | 600 mA | | **Operating Temperature** | -40°C to +125°C | --- ### 3. Key Construction Features * **Wire-wound Technology:** Unlike multilayer inductors, these use a copper wire wound around a ceramic core. This results in much higher Q factors and higher current handling capabilities. * **Ceramic Core:** Provides excellent thermal stability and a very high self-resonant frequency, making it ideal for RF (Radio Frequency) applications. * **Small Footprint:** The 0805 package is standard for automated PCB assembly (SMT). --- ### 4. Common Applications Due to its high SRF and Q factor, the AISC-0805-R056 is primarily used in: 1. **RF Transceivers:** Filtering and matching circuits in wireless communication. 2. **Bluetooth/WLAN:** Signal conditioning for high-speed data modules. 3. **Mobile Devices:** Impedance matching for antennas. 4. **Broadband ICs:** Decoupling and noise suppression in high-frequency signal paths.