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STM32F732ICK6 Folha de dados(PDF) 117 Page - STMicroelectronics |
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STM32F732ICK6 Folha de dados(HTML) 117 Page - STMicroelectronics |
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117 / 122 page ![]() DocID028480 Rev 1 117/122 STM32F732xx STM32F733xx Package information 118 Figure 38. WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale package recommended footprint Table 23. WLCSP100 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm Stencil thickness 0.1 mm |
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