STM32F378VC datasheet(115/131 Pages) STMICROELECTRONICS

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DocID025608 Rev 4

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STM32F378xx

Package information

128

Device Marking for WLCSP66

The following figure gives an example of topside marking orientation versus pin 1 identifier

location.

Figure 36. WLCSP66 marking example (package top view)

1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet

qualified and therefore not yet ready to be used in production and any consequences deriving from such

usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering

samples in production. ST Quality has to be contacted prior to any decision to use these Engineering

samples to run qualification activity.

0.484

0.0191

0.515

0.0203

aaa

0.100

0.0039

bbb

0.100

0.0039

ccc

0.100

0.0039

ddd

0.050

0.0020

eee

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Table 74. WLCSP66 - 66-pin, 3.767 x 4.229 mm, 0.4 mm pitch wafer level chip scale

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

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