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STM8L151C4 Folha de dados(PDF) 120 Page - STMicroelectronics |
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STM8L151C4 Folha de dados(HTML) 120 Page - STMicroelectronics |
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120 / 142 page ![]() Package information STM8L151x4/6, STM8L152x4/6 120/142 DocID15962 Rev 15 10.3 UFQFPN48 package information Figure 46. UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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