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STM32F745VG Folha de dados(PDF) 203 Page - STMicroelectronics

Nome de Peças STM32F745VG
Descrição Electrónicos  ARM-based Cortex-M7 32b MCUFPU, 462DMIPS, up to 1MB Flash/32016 4KB RAM, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD
PDF  227 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F745VG Folha de dados(HTML) 203 Page - STMicroelectronics

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DocID027590 Rev 4
203/227
STM32F745xx STM32F746xx
Package information
226
Figure 86. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint
A2
-
0.380
-
-
0.0150
-
A3(2)
-
0.025
-
-
0.0010
-
b(3)
0.220
0.250
0.280
0.0087
0.0098
0.0110
D
4.504
4.539
4.574
0.1773
0.1787
0.1801
E
5.814
5.849
5.884
0.2289
0.2303
0.2317
e
-
0.400
-
-
0.0157
-
e1
-
4.000
-
-
0.1575
-
e2
-
4.800
-
-
0.1890
-
F
-
0.2695
-
-
0.0106
-
G
-
0.5245
-
-
0.0206
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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