PIC16C71 datasheet(305/337 Pages) MICROCHIP

305 / 337 page

DS30234D-page 305

PIC16C6X

Package Marking Information (Cont’d)

Legend:

MM...M

XX...X

Microchip part number information

Customer speciﬁc information*

Year code (last 2 digits of calender year)

Week code (week of January 1 is week '01’)

Facility code of the plant at which wafer is manufactured.

C = Chandler, Arizona, U.S.A.

Mask revision number for microcontroller

Assembly code of the plant or country of origin in which

part was assembled.

In the event the full Microchip part number cannot be marked on one

line, it will be carried over to the next line thus limiting the number of

available characters for customer speciﬁc information.

Note:

Standard OTP marking consists of Microchip part number, year code, week code,

facility code, mask revision number, and assembly code. For OTP marking beyond

this, certain price adders apply. Please check with your Microchip Sales Ofﬁce.

For QTP devices, any special marking adders are included in QTP price.

S = Tempe, Arizona, U.S.A.

AABBCAE

XXXXXXXXXXXX

AABBCAE

XXXXXXXXXXXXXXXXXXXX

MMMMMMMMMMMMMMMMMMXX

28-Lead SOIC

28-Lead SSOP

9517SBP

20I/SS025

PIC16C62

9515SBA

PIC16C62-20/S0111

Example

28-Lead Side Brazed Skinny Windowed

XXXXXXXXXXX

AABBCDE

Example

PIC16C62/JW

9517SBT

28-Lead CERDIP Skinny Windowed

XXXXXXXXXXXXXX

AABBCDE

PIC16C66/JW

9517CAT

XXXXXXXXXXXXXXXXXX

AABBCDE

40-Lead PDIP

MMMMMMMMMMMMMM

9510CAA

Example

PIC16C65-04/P

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