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PIC16F87XATI/ML Folha de dados(PDF) 177 Page - Microchip Technology |
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PIC16F87XATI/ML Folha de dados(HTML) 177 Page - Microchip Technology |
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177 / 234 page ![]() 2001-2013 Microchip Technology Inc. DS39582C-page 177 PIC16F87XA IPD Power-down Current(3,5) D020 16LF87XA — 7.5 30 AVDD = 3.0V, WDT enabled, -40 C to +85C D020 16F87XA — 10.5 42 60 A A VDD = 4.0V, WDT enabled, -40 C to +85C VDD = 4.0V, WDT enabled, -40 C to +125C (extended) D021 16LF87XA — 0.9 5 AVDD = 3.0V, WDT disabled, 0 C to +70C D021 16F87XA — 1.5 16 20 A A VDD = 4.0V, WDT disabled, -40 C to +85C VDD = 4.0V, WDT disabled, -40 C to +125C (extended) D021A 16LF87XA 0.9 5 AVDD = 3.0V, WDT disabled, -40 C to +85C D021A 16F87XA 1.5 19 A VDD = 4.0V, WDT disabled, -40 C to +85C D023 IBOR Brown-out Reset Current(6) — 85 200 A BOR enabled, VDD = 5.0V 17.1 DC Characteristics: PIC16F873A/874A/876A/877A (Industrial, Extended) PIC16LF873A/874A/876A/877A (Industrial) (Continued) PIC16LF873A/874A/ 876A/877A (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial PIC16F873A/874A/876A/877A (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Symbol Characteristic/ Device Min Typ† Max Units Conditions Legend: Rows with standard voltage device data only are shaded for improved readability. † Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading, switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS. 4: For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k . 5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for design guidance only. This is not tested. 6: The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached. |
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