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ST72589BW Folha de dados(PDF) 153 Page - STMicroelectronics

Nome de Peças ST72589BW
Descrição Electrónicos  8-BIT MCU WITH NESTED INTERRUPTS, DOT MATRIX LCD, ADC, TIMERS, PWM-BRM, SPI, SCI, I²C, CAN INTERFACES
PDF  158 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72589BW Folha de dados(HTML) 153 Page - STMicroelectronics

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PACKAGE MECHANICAL DATA (Cont’d)
Figure 80. 128-Pin Economic Quad Flat Package
Note: “QUALIFICATION OR VOLUME PRODUCTION OF DEVICES USING EPOXY PACKAGES
(ESO/EDIL/EQFP) IS NOT AUTHORIZED It is expressly specified that qualification and/or volume pro-
duction of devices using the package E.... in any applications is not authorized. Usage in any application
is strictly restricted to development purpose.
Similar devices are available in plastic package mechanically compatible to the epoxy package for quali-
fication and volume production.”
Figure 81. Recommended Reflow Oven Profile (MID JEDEC)
REFLOW SOLDERING ONLY
Dim
mm
inches
Min
Typ
Max
Min
Typ
Max
A
2.40
0.094
A1
0.03
0.001
B
0.17
0.22
0.27 0.007 0.009 0.011
D
23.00 23.20 23.40 0.906 0.913 0.921
D1
18.57 18.72 18.97 0.731 0.737 0.747
E
17.00 17.20 17.40 0.669 0.677 0.685
E1
12.57 12.72 12.97 0.495 0.501 0.511
e
0.50
0.020
G
13.60
0.535
G1
19.60
0.772
G2
1.80
0.071
L
1.40
0.055
L1
1.60
0.063
Øn
0.35
0.014
ØP
1.10
0.043
Number of Pins
N
128 (ND=38 / NE=26)
EQFP128
250
200
150
100
50
0
100
200
300
400
Time [sec]
Temp. [°C]
ramp up
2°C/sec for 50sec
90 sec at 125°C
150 sec above 183°C
ramp down natural
2°C/sec max
Tmax=220+/-5°C
for 25 sec



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