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ST72311R Folha de dados(PDF) 144 Page - STMicroelectronics

Nome de Peças ST72311R
Descrição Electrónicos  8-BIT MCU WITH NESTED INTERRUPTS, EEPROM, ADC, 16-BIT TIMERS, 8-BIT PWM ART, SPI, SCI, CAN INTERFACES
PDF  164 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72311R Folha de dados(HTML) 144 Page - STMicroelectronics

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EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to VDD are not implemented. An additional
local protection between the pad and VSS (5a &
5b) is implemented to completly absorb the posi-
tive ESD discharge.
Multisupply Configuration
When several types of ground (VSS,VSSA, ...) and
power supply (VDD,VDDA, ...) are available for any
reason (better noise immunity...), the structure
shown in Figure 81 is implemented to protect the
device against ESD.
Figure 79. Positive Stress on a True Open Drain Pad vs. VSS
Figure 80. Negative Stress on a True Open Drain Pad vs. VDD
Figure 81. Multisupply Configuration
IN
VDD
VSS
(1)
(2b)
(4)
OUT
VDD
VSS
(3b)
Main path
Path to avoid
(5a)
(5b)
IN
VDD
VSS
(1)
(2b)
(4)
OUT
VDD
VSS
(3b)
Main path
(3b)
(3b)
VDDA
VSSA
VDDA
VDD
VSS
BACK TO BACK DIODE
BETWEEN GROUNDS
VSSA



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