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9.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

Changes from April 30, 2025 to July 15, 2025 (from Revision B (April 2025) to Revision C (July

2025))

Page

• (Features): Updated Functional Safety Compliance from "targeted" to "certified"............................................. 1

• (Absolute Maximum Ratings): Added note about Latch-up Current Pulse Injection on specified LVCMOS

pins................................................................................................................................................................... 84

Changes from November 7, 2024 to April 30, 2025 (from Revision A (November 2024) to

Revision B (April 2025))

Page

• (Features): Updated Features section layout..................................................................................................... 1

• (Applications): Added additional applications..................................................................................................... 4

• (Package Information): Updated Package Information table to align with TI Standard and added table notes. 5

• (Package Information): Added non-Q1 package options for ZCZ and ZEJ packages........................................5

• (Functional Block Diagram): Updated Functional Block Diagram.......................................................................6

• (Package Comparison): Added Q1 packages to column headers......................................................................8

• (Package Comparison): Removed JTAG ID section from Package Comparison table...................................... 8

• (Package Comparison): Updated Package Comparison rows under peripherals to concatenate instances and

simplify comparison............................................................................................................................................ 8

• (Package Comparison): Added table notes for TCM, PRU-ICSS, and miscellaneous section.......................... 8

• (Package Comparison): Updated SDFM information for ZNC packages and added note................................. 8

• (Device Identification): Added section.............................................................................................................. 10

• (Related Products): Updated Related Products to reflect TI offerings..............................................................11

• (Pin Attributes): Removed power column......................................................................................................... 20

• (Pin Attributes): Added Ball State During Reset, Ball State After Reset, Hysteresis, and Pull Type columns..20

• (Pin Attributes): Updated ADCVREFHI and ADCVREFLO line items for ZNC package.................................. 20

• (Pin Attributes): Removed Mux Mode 3 line item from GPIO122.....................................................................20

• (Pin Attributes): Removed Mux Mode 15 line items from Pin Attributes table..................................................20

• (Pin Attributes): Updated all "1.2V" IO voltage items to "1.2V/1.25V".............................................................. 20

• (ADC-CMPSS Signal Connections): Added section.........................................................................................54

• (ADC_CAL Signal Descriptions): Added table notes........................................................................................56

• (ADC_VREF Signal Descriptions): Added table notes..................................................................................... 56

• (ADC_VREF Signal Descriptions): Updated ZNC Pin column......................................................................... 56

• (DAC Signal Descriptions): Added table notes.................................................................................................59

• (GPIO Signal Descriptions): Updated descriptions for SOP pins..................................................................... 61

• (GPIO Signal Descriptions): Added table notes............................................................................................... 61

• (GPMC0 Signal Descriptions): Added tables note............................................................................................65

• (I2C Signal Descriptions): Added table notes...................................................................................................68

• (OSPI Signal Descriptions): Added table notes................................................................................................69

AM2612, AM2611, AM2611-Q1, AM2612-Q1

SPRSPA7C – SEPTEMBER 2024 – REVISED JULY 2025

www.ti.com

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