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STM32L452VC Folha de dados(PDF) 191 Page - STMicroelectronics

Nome de Peças STM32L452VC
Descrição Electrónicos  Ultra-low-power ARM® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 512KB Flash, 160KB SRAM, analog, audio, ext. SMPS
PDF  210 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L452VC Folha de dados(HTML) 191 Page - STMicroelectronics

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STM32L452xx
Package information
207
Figure 44. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array
package recommended footprint
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Other optional marking or inset/upset marks, which identify the parts throughout supply
chain operations, are not indicated below.
Z
-
0.750
-
-
0.0295
-
ddd
-
-
0.080
-
-
0.0031
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 103. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the solder mask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Table 102. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.



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