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STM32F427NET7XXX Folha de dados(PDF) 211 Page - STMicroelectronics

Nome de Peças STM32F427NET7XXX
Descrição Electrónicos  ARM Cortex-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/2564KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT
PDF  231 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F427NET7XXX Folha de dados(HTML) 211 Page - STMicroelectronics

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STM32F427xx STM32F429xx
Package information
225
Figure 96. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch
ball grid array recommended footprint
Note:
Non-solder mask defined (NSMD) pads are recommended.
Note:
4 to 6 mils solder paste screen printing process.
F
0.450
0.500
0.550
0.0177
0.0197
0.0217
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 117. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5
Dpad
0.27 mm
Dsm
0.35 mm typ. (depends on the soldermask
registration tolerance)
Solder paste
0.27 mm aperture diameter.
Table 116. UFBGA169 - 169-ball 7 x 7 mm 0.50 mm pitch, ultra fine pitch ball grid array
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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