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STM32H563AI Folha de dados(PDF) 257 Page - STMicroelectronics |
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STM32H563AI Folha de dados(HTML) 257 Page - STMicroelectronics |
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257 / 270 page ![]() DS14258 Rev 5 257/270 STM32H562xx and STM32H563xx Package information 265 Figure 91. UFBGA169 - Footprint example Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. Table 136. UFBGA169 - Example of PCB design rules (0.5 mm pitch BGA) Dimension Values Pitch 0.5 mm Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. BGA_WLCSP_FT_V1 Dsm Dpad |
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