ES9822PRO datasheet(115/126 Pages) ESS

Nome de Peças	ES9822PRO

Descrição Electrónicos	32-bit High-Performance 2-Channel ADC

PDF	126 Pages

Scroll/Zoom	100%

Fabricante Electrônico	ESS [ESS Technology,Inc]

Página de início	http://www.esstech.com

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ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 WWW.ESSTECH.COM

115

ES9822 PRO Product Datasheet

RPC-2 Pb-Free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3, <350

Volume mm3, 350 to 2000

Volume mm3, >2000

<1.6 mm

260°C

1.6 mm – 2.5 mm

260°C

250°C

245°C

>2.5 mm

250°C

245°C

Table 29 - RPC-2 Pb-Free Process

At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the

values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc).

Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.

The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes

reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.

ES9822PRO Folha de dados(PDF) 115 Page - ESS Technology,Inc