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KSZ9563RNXI-TR Folha de dados(PDF) 218 Page - Microchip Technology

Nome de Peças KSZ9563RNXI-TR
Descrição Electrónicos  3-Port Gigabit Ethernet Switch with RGMII/MII/RMII Interface and IEEE 1588v2
PDF  226 Pages
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Fabricante Electrônico  MICROCHIP [Microchip Technology]
Página de início  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

KSZ9563RNXI-TR Folha de dados(HTML) 218 Page - Microchip Technology

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KSZ9563R
DS00002419D-page 218
 2017-2018 Microchip Technology Inc.
FIGURE 8-3:
PACKAGE (LAND PATTERN)
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
6.60
6.60
MILLIMETERS
0.40 BSC
MIN
E
MAX
7.90
Contact Pad Length (X64)
Contact Pad Width (X64)
Y1
X1
0.80
0.20
Microchip Technology Drawing C04-2437A
NOM
64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN]
SILK SCREEN
1
2
64
C1
C2
E
X1
Y1
G1
Y2
X2
C1
Contact Pad Spacing
7.90
Contact Pad to Center Pad (X64)
G1
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
ØV
EV
EV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:



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