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STM32L062C8 Folha de dados(PDF) 112 Page - STMicroelectronics |
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STM32L062C8 Folha de dados(HTML) 112 Page - STMicroelectronics |
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112 / 124 page ![]() Package information STM32L062x8 112/124 DS10183 Rev 11 7.5 UFQFPN32 package information Figure 42. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. A0B8_ME_V3 1 32 PIN 1 Identifier SEATINGPLANE C C ddd A A1 A3 e b D1 b E2 L e E1 E D2 L D |
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