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AM6546 Folha de dados(PDF) 140 Page - Texas Instruments

Nome de Peças AM6546
Descrição Electrónicos  AM654x, AM652x Sitara™ Processors Silicon Revision 2.1
PDF  284 Pages
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Fabricante Electrônico  TI [Texas Instruments]
Página de início  http://www.ti.com
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AM6546 Folha de dados(HTML) 140 Page - Texas Instruments

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7.8 Thermal Resistance Characteristics
This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below
the TJ value identified in Section 7.4, Recommended Operating Conditions.
7.8.1 Thermal Resistance Characteristics
It is recommended to perform thermal simulations at the system level with the worst case device power consumption
NO.
NAME
DESCRIPTION
ACD
°C/W(1) (3)
AIR FLOW
(m/s)(2)
T1
RΘJC
Junction-to-case
0.2
N/A
T2
RΘJB
Junction-to-board
3.1
N/A
T3
RΘJA
Junction-to-free air
12.8
0
T4
Junction-to-moving air
7.4
1
T5
6.5
2
T6
6
3
T7
ΨJT
Junction-to-package top
0.1
0
T8
0.1
1
T9
0.1
2
T10
0.1
3
T11
ΨJB
Junction-to-board
2.9
0
T12
2.4
1
T13
2.3
2
T14
2.3
3
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
m/s = meters per second.
(3)
°C/W = degrees Celsius per watt.
AM6548, AM6528, AM6546, AM6526
SPRSP52B – DECEMBER 2019 – REVISED JUNE 2021
www.ti.com
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Product Folder Links: AM6548 AM6528 AM6546 AM6526



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