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STM32F405RG Folha de dados(PDF) 163 Page - STMicroelectronics |
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STM32F405RG Folha de dados(HTML) 163 Page - STMicroelectronics |
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163 / 201 page ![]() DocID022152 Rev 6 163/201 STM32F405xx, STM32F407xx Package information 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 6.1 WLCSP90 package information Figure 75. WLCSP90 - 4.223 x 3.969 mm, 0.400 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. |
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