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ST25DV64K Folha de dados(PDF) 155 Page - STMicroelectronics

Nome de Peças ST25DV64K
Descrição Electrónicos  Dynamic NFC/RFID tag IC with 4-Kbit, 16-Kbit or 64-Kbit EEPROM, and fast transfer mode capability
PDF  200 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST25DV64K Folha de dados(HTML) 155 Page - STMicroelectronics

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 155 / 200 page
background image
Symbol
millimeters
inches (1)
Min
Typ
Max
Min
Typ
Max
A1
-
0.095
-
-
0.0037
-
A2
-
0.175
-
-
0.0069
-
A3
-
0.025
-
-
0.0010
-
b
-
0.185
-
-
0.0073
-
D
-
1.649
1.669
-
0.0649
0.0657
E
-
1.483
1.503
-
0.0584
0.0592
e
-
0.400
-
-
0.0157
-
e1
-
0.800
-
-
0.0315
-
H
-
0.346
-
-
0.0136
-
I
-
1.039
-
-
0.0409
-
J
-
0.200
-
-
0.0079
-
F
-
0.314
-
-
0.0124
-
G
-
0.342
-
-
0.0135
-
aaa
-
0.110
-
-
0.0043
-
bbb
-
0.110
-
-
0.0043
-
ccc
-
0.110
-
-
0.0043
-
ddd
-
0.060
-
-
0.0024
-
eee
-
0.060
-
-
0.0024
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 85. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale recommended footprint
Dpad
Dsm
Table 260. WLCSP10 recommended PCB design rules
Dimension
Recommended values
Pitch
0.4 mm
Dpad
0,225 mm
Dsm
0.290 mm typ. (depends on soldermask registration tolerance)
Stencil opening
0.250 mm
Stencil thickness
0.100 mm
ST25DV04K ST25DV16K ST25DV64K
WLCSP10 package information
DS10925 - Rev 9
page 155/200



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