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ST25DV64KC Folha de dados(PDF) 159 Page - STMicroelectronics |
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ST25DV64KC Folha de dados(HTML) 159 Page - STMicroelectronics |
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159 / 203 page ![]() Symbol millimeters inches (1) Min Typ Max Min Typ Max J - 0.200 - - 0.0079 - F - 0.314 - - 0.0124 - G - 0.342 - - 0.0135 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 90. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale recommended footprint Dpad Dsm Table 263. WLCSP10 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm ST25DV04KC ST25DV16KC ST25DV64KC WLCSP10 package information DS13519 - Rev 3 page 159/203 |
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