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STM32WB55 Folha de dados(PDF) 177 Page - STMicroelectronics

Nome de Peças STM32WB55
Descrição Electrónicos  Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.2 and 802.15.4 radio solution
PDF  193 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WB55 Folha de dados(HTML) 177 Page - STMicroelectronics

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STM32WB55xx STM32WB35xx
Package information
185
7.3
VFQFPN68 package information
VFQFPN68 is a 8 x 8 mm, 0.4 mm pitch, very thin fine pitch quad flat package.
Figure 44. VFQFPN68 package outline
1. VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Packages No lead. Sawed
version. Very thin profile: 0.80 < A ≤ 1.00 mm.
2. The pin #1 identifier must be existed on the top surface of the package by using indentation mark or other
feature of package body. Exact shape and size of this feature is optional.
Table 104. VFQFPN68 mechanical data
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.80
0.90
1.00
0.0315
0.0354
0.0394
A1
0
0.02
0.05
0
0.0008
0.0020
A3
-
0.20
-
-
0.0008
-
b
0.15
0.20
0.25
0.0059
0.0079
0.0098
D
7.85
8.00
8.15
0.3091
0.3150
0.3209
D2
6.30
6.40
6.50
0.2480
0.2520
0.2559
C
D
E
TOP VIEW
PIN 1 IDENTIFIER
LASER MARKING
68 67
1
2
(2X)
0.10 C
D2
E2
68 67
2
1
PIN 1 ID
C 0.30 X 45'
e
b
BOTTOM VIEW
L
EXPOSED PAD AREA
SIDE VIEW
E
SEATING
PLANE
ddd C
A
A1
A2
B029_VFQFPN68_ME_V1



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