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STM32L071VB Folha de dados(PDF) 138 Page - STMicroelectronics |
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STM32L071VB Folha de dados(HTML) 138 Page - STMicroelectronics |
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138 / 148 page ![]() Package information STM32L071xx 138/148 DS10690 Rev 7 7.10 UFQFPN32 package information Figure 64. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. A0B8_ME_V3 1 32 PIN 1 Identifier SEATINGPLANE C C ddd A A1 A3 e b D1 b E2 L e E1 E D2 L D |
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