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STM32L552VCU3PXXX Folha de dados(PDF) 318 Page - STMicroelectronics

Nome de Peças STM32L552VCU3PXXX
Descrição Electrónicos  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU, 165 DMIPS, up to 512 KB Flash memory, 256 KB SRAM, SMPS
PDF  340 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L552VCU3PXXX Folha de dados(HTML) 318 Page - STMicroelectronics

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Package information
STM32L552xx
318/340
DS12737 Rev 6
Figure 86. WLCSP 81 recommended footprint
1. Dimensions are expressed in millimeters.
e
-
0.40
-
-
0.016
-
e1
-
3.20
-
-
0.126
-
e2
-
3.20
-
-
0.126
-
F(4)
-
0.580
-
-
0.023
-
G(4)
-
0.435
-
-
0.017
-
aaa
-
0.10
-
-
0.004
-
bbb
-
0.10
-
-
0.004
-
ccc
-
0.10
-
-
0.004
-
ddd
-
0.05
-
-
0.002
-
eee
-
0.05
-
-
0.002
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal
and tolerances values of A1 and A2.
3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process
capability.
4. Calculated dimensions are rounded to the 3rd decimal place.
Table 156. WLCSP81 mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
BGA_WLCSP_FT_V1
Dsm
Dpad



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