STM32G071EB datasheet(127/133 Pages) STMICROELECTRONICS

Nome de Peças	STM32G071EB

Descrição Electrónicos	Arm Cortex-M0 32-bit MCU, up to 128 KB Flash, 36 KB RAM

PDF	133 Pages

Scroll/Zoom	100%

Fabricante Electrônico	STMICROELECTRONICS [STMicroelectronics]

Página de início	http://www.st.com

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127 / 133 page

DS12232 Rev 3

127/133

STM32G071x8/xB

Package information

128

Figure 54. Recommended PCB pad design for WLCSP25 package

1.60

0.063

F(4)

0.350

0.014

G(4)

0.440

0.017

aaa

0.10

0.004

bbb

0.10

0.004

ccc

0.10

0.004

ddd

0.05

0.002

eee

0.05

0.002

1. Values in inches are converted from mm and rounded to 3 decimal digits.

2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal

values and tolerances of A1 and A2.

3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process

capability.

4. Calculated dimensions are rounded to the 3rd decimal place

Table 83. Recommended PCB pad design rules for WLCSP25 package

Dimension

Recommended value (mm)

Pitch

0.4

Dpad

225

Dsm

0.290 typ.(1)

Depends on the solder mask registration tolerance

Stencil opening

0.250

Stencil thickness

0.100

Table 82. WLCSP25 mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

MS18965V2

Dsm

Dpad

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