STM32MP151F datasheet(247/253 Pages) STMICROELECTRONICS

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DS12501 Rev 3

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STM32MP151C/F

Package information

248

7.5

Thermal characteristics

Package thermal characteristics in Table 122 are specified with conditions as per JEDEC

JESD51-6, JESD51-8, JESD51-9, and JESD51-12. These typical values will vary in function

of board thermal characteristics and other components on the board.

ΘJA :

Thermal resistance junction-ambient.

ΘJB:

Thermal resistance junction-board.

ΘJC:

Thermal resistance junction-top-case.

Θjb:

Thermal parameter junction-board.

Ψjt:

Thermal parameter junction-top-case.

Motherboard type: four layers, JEDEC 2S2P

Table 122. Thermal characteristics

Symbol

Parameter

Value

Unit

Natural convection

1m/s (200 ft/mn)

ΘJA(1)

TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch

36.079

31.79

°C/W

TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch

35.151

30.953

LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch

34.145

30.121

LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch

28.545

24.797

ΘJB(2)

TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch

19.487

°C/W

TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch

20.555

LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch

22.038

LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch

17.409

ΘJC(3)

TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch

10.768

°C/W

TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch

10.049

LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch

9.675

TLFBGA448 - 448-ball 18x18 mm 0.80 mm pitch

8.439

Ψjb (4)

TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch

18.949

18.332

°C/W

TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch

20.002

19.398

LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch

21.456

20.894

LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch

16.946

16.574

Ψjt (5)

TFBGA257 - 257-ball 10x10 mm 0.50/0.65 mm pitch

0.383

0.812

°C/W

TFBGA361 - 361-ball 12x12 mm 0.50/0.65 mm pitch

0.354

0.735

LFBGA354 - 354-ball 16x16 mm 0.80 mm pitch

0.339

0.658

LFBGA448 - 448-ball 18x18 mm 0.80 mm pitch

0.297

0.542

1. Per JEDEC JESD51-9

2. Per JEDEC JESD51-8

3. Per JEDEC JESD51-12 best practice guidelines

4. Per JEDEC JESD51-12.

5. Per JEDEC JESD51-12.

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