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ST72F521M Folha de dados(PDF) 174 Page - STMicroelectronics

Nome de Peças ST72F521M
Descrição Electrónicos  8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, FIVE TIMERS, SPI, SCI, I2C, CAN INTERFACE
PDF  199 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST72F521M Folha de dados(HTML) 174 Page - STMicroelectronics

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EMC CHARACTERISTICS (Cont’d)
True Open Drain Pin Protection
The centralized protection (4) is not involved in the
discharge of the ESD stresses applied to true
open drain pads due to the fact that a P-Buffer and
diode to VDD are not implemented. An additional
local protection between the pad and VSS (5a &
5b) is implemented to completely absorb the posi-
tive ESD discharge.
Multisupply Configuration
When several types of ground (VSS, VSSA, ...) and
power supply (VDD, VAREF, ...) are available for
any reason (better noise immunity...), the structure
shown in Figure 95 is implemented to protect the
device against ESD.
Figure 93. Positive Stress on a True Open Drain Pad vs. VSS
Figure 94. Negative Stress on a True Open Drain Pad vs. VDD
Figure 95. Multisupply Configuration
IN
VDD
VSS
(1)
(2b)
(4)
OUT
VDD
VSS
(3b)
Main path
Path to avoid
(5a)
(5b)
IN
VDD
VSS
(1)
(2b)
(4)
OUT
VDD
VSS
(3b)
Main path
(3b)
(3b)
VAREF
VSSA
VAREF
VDD
VSS
BACK TO BACK DIODE
BETWEEN GROUNDS
VSSA



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