Fabricante Electrônico | Nome de Peças | Folha de dados | Descrição Electrónicos |
List of Unclassifed Man... |
SM2615FTR845
|
131Kb / 2P |
High temperature molded encapsulation
|
Vishay Siliconix |
WSRHP
|
103Kb / 4P |
Molded high temperature encapsulation
Revision: 21-Oct-16 |
List of Unclassifed Man... |
SM6227JT62R0
|
130Kb / 2P |
High temperature molded encapsulation
|
MPS Industries, Inc. |
R7X1210M
|
160Kb / 1P |
ENCAPSULATION MOLDED CHIP INDUCTOR
|
R7X1008M
|
160Kb / 1P |
ENCAPSULATION MOLDED CHIP INDUCTOR
|
Vishay Siliconix |
WSCWSN
|
101Kb / 3P |
All welded construction, Molded encapsulation, Wraparound terminations
Revision: 17-Feb-11 |
Sangdest Microelectroni... |
209CNQ
|
140Kb / 4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and
|
63CPQ080
|
141Kb / 5P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
400CMQ
|
210Kb / 4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
MBR2535
|
204Kb / 6P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|